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Curamik ceramic substrates.
Useable area 127 mm x 178 mm 0 05 copper peeling strength 4 0 n mm 50 mm min for dbc with 0 3 mm cu thickness 10 0 n mm 50 mm min for amb with 0 5 mm cu thickness platings electroless ni.
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The substrates ain direct bond copper dbc provides an adjusted thermal expansion coefficient which is closer to that of silicon and results in little tension in the solder layer between chip and substrate.
Our curamik ceramic substrates offer high heat conductivity high heat capacity and thermal spreading of the substrates thick copper cladding making our substrates indispensable to power electronics.
The doping process provides enhanced robustness and improved properties when exposed to mechanical constraints.
Curamik provides two technologies to attach the substrate with the copper.
Global dbc ceramic substrate market 2020 rogers curamik germany kcc korea ferrotec shanghai shenhe thermo magnetics electronics china sourabhkshirsagardm uncategorized april 27 2020 2 minutes.
Dbc direct bond copper a high tem.
These substrates offer a longer lifetime and greater reliability and performance than alumina substrates and it comes at a competitive price point.
Our engineers have an international reputation for machining to a very high degree of accuracy.
Our curamik power plus substrates are based on zr doped al 2 o 3 hps ceramic.
Our curamik performance substrates are based on si 3 n 4 ceramics joined with copper by active metal brazing amb.
These substrates are ideal for applications that demand a long lifetime high power density and robustness.
Partial discharge free substrates free of partial discharge for power modules 1 7 kv.
Aln ceramic substrates market globally by 2025.
Download the complete technical data sheet with all curamik advantage features.
Curamik high temperature high voltage substrates consist of pure copper bonded to a ceramic substrate such as al2o3 alumina aln aluminum nitride hps zro2 doped or silicon based si3n4 silicon nitride.
Our curamik thermal substrates offer the best thermal conductivity in the industry.
3 µm 7 µm 8 2 p all.
